Long range communication is difficult in terahertz band because the received power decreases in inverse proportion to the square of the operation frequency [1]. However, the gain of the antenna with the same physical aperture increases when the frequency becomes high. Therefore, the development of high-gain antennas is the first challenge in sub-terahertz band. Furthermore, as high-gain antennas narrow the beams, beam-scanning antennas are necessary to cover the required angular area for communication. Low loss feeding is important for high efficiency of aperture antennas. Thus, high-gain, beam-scanning and low-loss feeding are key technologies in the development of sub-terahertz antennas.
Lens antennas are advantageous in terahertz band since it is originally optical technology. The beam-scanning function can be realized by shifting the primary radiator from the focus of the lens. Continuous or discrete beam-scanning operation is obtained by mechanical shifting the lens or switching the primary radiators, respectively. The total height of the lens antenna is the sum of the focal length and the thickness of the lens. Low profile is essentially impossible for dielectric lens antennas. When the focal length is set to be short, the lens thickness becomes large for large refraction. To reduce the thickness, high permittivity material is effective. However, high permittivity always accompanies high loss tangent, and the material exhibits high dielectric loss. Furthermore, the uniformity of the permittivity distribution is important in the production of the lens.
Planar arrays on printed substrate are popular to achieve low-profile and high-gain antennas. However, the transmission loss of planar lines in the substrate is significant in sub-terahertz band. Dielectric loss increases for frequency. Conductor loss increases as well due to the surface roughness of the copper foil to stick with the dielectric sheet. New dielectric materials to stick with copper foil strongly without surface roughness are expected for high-gain planar antennas.
Furthermore, antenna dimensions become small in proportion to the wavelength. Fine pitch patterns are necessary in sub-terahertz band. Modified semi-additive process (MSAP) is becoming popular [2].
Phased arrays can be composed of antenna elements with RF circuits [3]. To reduce the feeding loss, on-chip antenna and Antenna-in-Package (AiP) techniques have been developed for integration of an antenna with an RF circuit [4]. On-chip antenna is the technique to integrate the antenna on the IC chip together with the RF circuit. The length and the loss of the transmission line become minimum when antennas are on chip. However, silicon substrate is lossy and the cost for the antenna area on the IC is high. AiP technique is a reasonable solution. An antenna is formed in the substrate on which the IC is mounted. However, the losses of the transmission lines on the substrate exist. The matching design of the connection between the IC and the substrate is necessary such as wire bonding or bump connection of flip-chip IC mounting.
In the development of sub-terahertz antennas beyond 100GHz band, not only the antenna design techniques but also the material technologies for lens antennas and substrates, metal pattern manufacturing, IC chip mounting techniques are important.
Collaboration of these technologies in various areas are expected to apply the high-frequency techniques to the practical communication and sensing systems in this frequency band.
References
[1] D. Serghiou, M. Khalily, T. W. C. Brown and R. Tafazolli, "Terahertz Channel Propagation Phenomena, Measurement Techniques and Modeling for 6G Wireless Communication Applications: A Survey, Open Challenges and Future Research Directions," in IEEE Communications Surveys & Tutorials, vol. 24, no. 4, pp. 1957-1996, Fourthquarter 2022.
[2] S. Acharya, S. S. Chouhan and J. Delsing, "An Additive Production approach for Microvias and Multilayered polymer substrate patterning of 2.5μm feature sizes," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1304-1308.
[3] B. Sadhu, X. Gu and A. Valdes-Garcia, "The More (Antennas), the Merrier: A Survey of Silicon-Based mm-Wave Phased Arrays Using Multi-IC Scaling," in IEEE Microwave Magazine, vol. 20, no. 12, pp. 32-50, Dec. 2019.
[4] T. Zwick, F. Boes, B. Göttel, A. Bhutani and M. Pauli, "Pea-Sized mmW Transceivers: QFN-?Based Packaging Concepts for Millimeter-Wave Transceivers," in IEEE Microwave Magazine, vol. 18, no. 6, pp. 79-89, Sept.-Oct. 2017.